MUMBAI, India, April 17 -- Intellectual Property India has published a patent application (202641043108 A) filed by Sr University, Warangal, Telangana, on April 4, for 'adaptive layer deposition strategy for reducing mechanical anisotropy in fused deposition modeling (fdm) additive manufacturing.'
Inventor(s) include Dr. Yogesh Shrivastava; and Durgesh Nandan.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "A strategy of adaptive layer deposition of diminishing mechanical anisotropy in Fused Deposition Modeling (FDM) additive manufacturing is revealed. Its invention incorporates a structural analysis unit, an anisotropy mapping processor and a parameter scheduling unit into a slicing and / or firmware structure to adjust deposition parameters in real time through a pattern. To determine the localized stress distributions and load paths, a three-dimensional digital model is considered and a spatial anisotropy map is created. According to this map, the deposition parameters such as raster orientation, infill direction, layer thickness, extrusion temperature and print speed are assigned on the basis of layers on a layer-by-layer basis or region-specific on-the-fly. The edited toolpath instructions are represented in machine code that can be read by the printer in order to fabricate. In a non-obligatory form, sensor-based feedback can be used to modify deposition parameters in real-time to ensure the quality of inter layer bonding. The invention enhances the strength in the Z-direction, minimizes the risk of delamination and improves isotropy-like mechanical behavior without the use of special raw materials or post-processing to conserve material or without specific FDM hardware systems."
Disclaimer: Curated by HT Syndication.
