MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202411020168 A) filed by Chandigarh Group Of Colleges, Mohali, Punjab, on March 18, 2024, for 'adaptable edible peeling and slicing device.'
Inventor(s) include Varun Mishra; Himanshu Gogia; Nikita; and Bhaskar.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "An adaptable edible peeling and slicing device, comprising a platform 1 developed to be positioned on surface, touch interactive display panel 2 accessed by user to input dimensions, vertical support 3 integrated with a horizontal rod 4 with multiple pins 5 accessed by the user to engage an edible, AI-based imaging unit 6 for capturing images of the platform 1, telescopically operated bar 7 to position a plate on the bar 7 near to surface of the edible, multiple hinges 8 to tilt portions of the plate to acquire shape of a portion of the edible, motorized pivot joint 9 to provide angular movement to the plate, horizontal blade 10 to remove peel of the edible, an extendable link to extend/retract to provide scooping movement to a curved member 11 on spoiled portion of edible and cutting unit 12 to cut user-specified portion of edible."
Disclaimer: Curated by HT Syndication.
