MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517037696 A) filed by Danfoss A/S, Nordborg, Denmark, on April 18, for 'actuator for a heat pump valve assembly, valve assembly for a heat pump and heat pump with a valve assembly.'
Inventor(s) include Frank, Mikkel; and Therkildsen, Kristian.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "The present invention pertains to an actuator for a heat pump valve assembly. The actuator comprises a motor, a metallic housing and a heat management assembly with a metallic bottom flange portion, a metallic upper flange portion and a thermal insulating barrier provided between the bottom and upper flange portions, wherein the motor and the metallic housing are in direct contact with the metallic upper flange portion, and wherein the thermal insulating barrier consists of one or more components made of a material with a thermal conductivity of less than 1 W/(mK). The invention is also directed at a valve assembly for a heat pump, comprising an actuator and a valve portion for controlling a fluid flow, wherein the vale assembly is connected to the actuator via the actuator's heat management assembly. The invention is further directed at a heat pump with a valve assembly according to claim."
The patent application was internationally filed on Nov. 20, 2023, under International application No.PCT/EP2023/082401.
Disclaimer: Curated by HT Syndication.
