MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202611008934 A) filed by Swami Vivekananda Subharti University, Meerut, Uttar Pradesh, on Jan. 29, for 'a transdermal patch composition and a layered bi-phasic herbal transdermal patch for controlled pain management.'
Inventor(s) include Nandini Sharma.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a layered bi-phasic herbal transdermal patch composition for controlled and sustained pain management. The transdermal patch is defined by a weight-percentage (w/w) formulation and comprises a rapid-release layer and a sustained-release layer configured to deliver plant-derived phytoconstituents sequentially through the skin. The rapid-release layer contains fast-acting analgesic phytoconstituents such as capsaicin and eugenol dispersed in a fast-hydrating polymeric matrix to provide early pain relief. The sustained-release layer contains anti-inflammatory phytoconstituents such as curcumin or a curcumin-phospholipid complex and boswellic acids entrapped within a controlled-release polymeric matrix to provide prolonged therapeutic action. The patch further includes polymeric carriers, plasticizers, and permeation enhancers in defined weight percentages to regulate flexibility, adhesion, and transdermal flux. The invention provides non-invasive, long-acting pain relief, avoids first-pass metabolism, minimizes gastrointestinal side effects, and improves patient compliance for management of acute and chronic pain conditions."
Disclaimer: Curated by HT Syndication.
