MUMBAI, India, Feb. 27 -- Intellectual Property India has published a patent application (202641017882 A) filed by Shashank Davanagere; and Neelima Meermira, Hyderabad, Telangana, on Feb 17 for 'a system and method for loan application and associated risk profiling platform.'
Inventor(s) include Shashank Davanagere.
The application for the patent was published on Feb. 27, under issue no. 09/2026.
According to the abstract released by the Intellectual Property India: "A system and method for loan application and associated risk profiling platform is disclosed. The system and a memory with instructions causes to: Receive loan inputs via user device interface: business, financial, compliance data; evaluate eligibility versus criteria: business age, turnover, compliance, credit score; auto-reject if unmet; receive contextual inputs from reviewers on reputation, community role, industry risks; combine with AI outputs; generate risk profile indicating repayment likelihood, financial stress; compute standardized score as aggregated value of financial points and company points; award financial points from applicant data and benchmarking; assign partial random points if historical data unavailable; generate debt service confidence profile by modelling profit/loss from correlated business and macro drivers via simulation; simulate correlated scenarios to compute profit, CFADS, DSCR; determine repayment risk metrics: shortfall and covenant breach probabilities, percentile indicators; generate analytical outputs: summary, risk dashboard, sensitivities, distributions, correlations, validation."
Disclaimer: Curated by HT Syndication.
