MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202511114373 A) filed by Integral University, Lucknow, Uttar Pradesh, on Nov. 20, 2025, for 'a smart biodegradable active packaging system with edible coating and integrated nondestructive quality monitoring.'

Inventor(s) include Asfaq; and Malik Mobeen Ahmad.

The application for the patent was published on Jan. 9, under issue no. 02/2026.

According to the abstract released by the Intellectual Property India: "Disclosed herein is a smart biodegradable active packaging system with edible coating and integrated non-destructive quality monitoring (100) comprises an active biodegradable packaging layer (102) formed from agro-waste-derived biopolymers. The system also includes an edible coating layer (104) applied directly onto the surface of jaggery blocks, fruits, or other agro-based food products. A non-destructive quality monitoring module (106) configured to detect and measure environmental and product-specific parameters. A data acquisition and communication unit (108) configured to transmit the acquired data through low-energy Bluetooth or wireless communication. An integrated moisture and oxygen scavenging module (110) configured to dynamically regulate internal humidity and oxygen levels. A self-healing biopolymer matrix (112) formed by polymer blends. A modular agro-processing and packaging machinery unit (114) configured to perform on-site edible coating, drying, and sealing operations. An edible digital traceability layer (116) configured to store information related to batch number, origin, and production date."

Disclaimer: Curated by HT Syndication.