MUMBAI, India, Aug. 8 -- Intellectual Property India has published a patent application (202411004790 A) filed by Council Of Scientific And Industrial Research, New Delhi, on Jan. 23, 2024, for 'a single step process for the recycling of metal/polymer laminates.'
Inventor(s) include Parveen Saini; Neha; Anuj; Rahul Saha; and Sushil Kumar.
The application for the patent was published on Aug. 8, under issue no. 32/2025.
According to the abstract released by the Intellectual Property India: "The present invention belongs to the technical field for recycling of waste multilayer polymers (MLPs) packaging-based metal/polymer laminate materials via wet chemical process, and in particular focusing on delamination of polymeric layers and their demetallization via selective etching/dissolution of ultrathin aluminium layer, to isolate neat polymeric fraction for further processing and utilization. The method comprises of treatment of predecided sizes[shredded pieces of 2-4 mm size range] of the waste multilayers packaging (MLP) materials [composed of sandwiched thermoplastic polymer layer based multilayer laminates having coating of ultrathin aluminium layer on one of the polymeric layer] with a liquid medium [solution of a specific organic reagents e.g., chloroform, toluene, THF, DMF etc. and aqueous electrolyte e.g. KOH in the ratio range of 1:2 to 2:1], specified liquid medium to MLP ratio [10-30] by agitation for specified time [20 to 90 mins] and at specified temperature [40 to 60 0C] and specified agitation conditions [200 to 400 rpm] inside a reactor; thus affecting the delamination and demetallization, followed by separating the polymeric fractions from liquid medium, washing, and thus obtaining neat polymeric fraction and hydrogen gas a very important byproduct."
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