MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202631061010 A) filed by Technology Innovation In Exploration & Mining Foundation, Dhanbad, Jharkhand, on May 13, for 'a process for additive manufacturing and refurbishment of high-strength low-alloy (hsla) components and components therefrom.'
Inventor(s) include Dr. Amitava Mandal; and Dr. Shatarupa Biswas.
The application for the patent was published on May 29, under issue no. 22/2026.
According to the abstract released by the Intellectual Property India: "A process for additive manufacturing and refurbishment of High-Strength Low-Alloy (HSLA) components, comprising: a. depositing HSLA filler wire in a layer-by-layer method using a Wire Arc Additive Manufacturing (WAAM) process to build a structure; b. forming grooves on a top surface of each deposited layer; c. introducing a predetermined quantity of tungsten carbide (WC) powder onto the top surface comprising the grooves; d. depositing a subsequent layer of HSLA filler material over the WC powder to embed WC particles within a matrix; and e. repeating steps (b) to (d) during layer-wise deposition to produce a wear-resistant or refurbished HSLA component or region thereof having increased hardness, enhanced wear resistance, and durability."
Disclaimer: Curated by HT Syndication.
