Intellectual Property India Publishes Patent Application for 'A Power Modules And Panel-Level Methods Of Making The Same' Filed by Pep Innovation Pte. Ltd.

MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202424094167 A) filed by Pep Innovation Pte. Ltd., Singapore, on Nov. 30, 2024, for 'a power modules and panel-level methods of making the same.'

Inventor(s) include Chew, Hwee Seng; and Kumar, Munirathinam Senthil.

The application for the patent was published on June 20, under issue no. 25/2025.

According to the abstract released by the Intellectual Property India: "The present application discloses a power module having a semiconductor package in which all the interconnections are formed by direct Copper (Cu). In this way, the power module is suitable for high power efficiency. In addition, the direct Copper (Cu) interconnection also enhances heat dissipation of the semiconductor package and thus makes the power module more reliable for operation, particularly under a high temperature. power module further includes a substrate (either a Direct Bonded Copper (DBC) substrate or a Ceramic substrate) on which the semiconductor package is mounted on; a plurality of external connecting structures coupled to the substrate for electrically leading out the power module; and at least one signal lead mounted on the substrate."

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