MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202431003669 A) filed by Ekokul Private Limited, Contai, West Bengal, on Jan. 18, 2024, for 'a novel insulation system for buildings using thermoplastic rigid polymers foam boards and its method of fabrication thereof.'
Inventor(s) include Mr. Kausikbrata Maiti.
The application for the patent was published on July 25, under issue no. 30/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses a novel insulation system 22 for buildings having insulating layer characterized by a thermoplastic rigid polymers foam boards 34, light weighted bars/posts and filler materials 60. The present invention relates to a heat- insulating system, which provides thermal barrier properties desired in enclosed spaces having adjustable temperatures, including energy efficient residential building, offices, refrigerated containers, food cold storages, industrial construction and the like. This invention is fabricating thermal insulation structure independently from building wall and roof necessitates fewer steps, a new concept in the techniques which is readily adaptable to mass production techniques as is consequently economically desirable. The thermal insulation structure of the present invention is rigid, flexible, removable while still maintaining ease-of-use and low cost. Suitable wasted inert or filler materials are used in this present invention to provide an extra level of insulation by preventing the transfer of heat energy across the insulation systems."
Disclaimer: Curated by HT Syndication.
