MUMBAI, India, June 16 -- Intellectual Property India has published a patent application (202611053533 A) filed by Indian Institute Of Technology, Roorkee, Uttarakhand, on April 27, for 'a novel conical origami metamaterial-architected support system for deployable structures.'
Inventor(s) include Tiwari, Alok Kumar; Upadhyay, Sanjay Hariharbhai; and Mukhopadhyay, Tanmoy.
The application for the patent was published on June 5, under issue no. 23/2026.
According to the abstract released by the Intellectual Property India: "Examples of a compressible support structure (100) are described herein. The compressible support structure (100) comprises a top face panel (108), a bottom face panel (110) being dimensionally different from the top face panel (108), and an elastically collapsible connector connecting the top face panel (108) and the bottom face panel (110). The elastically collapsible connector has a plurality of first polygon panels (101) and a plurality of second polygon panels (102). Each of the plurality of first polygon panels (101) is connected to at least one adjacent second polygon panel (102) and is movable with respect to the at least one adjacent polygon panel (102) in an origami folding pattern."
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