MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202611052919 A) filed by Noida Institute Of Engineering & Technology, Greater Noida, Uttar Pradesh, on April 25, for 'a modular die assembly for rapid mold configuration.'
Inventor(s) include Dr. Abdhesh Kumar; and Atul Ranjan.
The application for the patent was published on May 29, under issue no. 22/2026.
According to the abstract released by the Intellectual Property India: "A modular die assembly for rapid mold configuration includes a base frame, a first mounting platen, a second mounting platen, interchangeable die modules, alignment keys, guide pillars, quick-lock clamps, service channel connectors, a support spacer set, and an ejection support interface. Selected modules are rapidly installed on the common base frame through standardized seating and locking interfaces to generate different mold arrangements with repeatable alignment, utility adaptability, structural stability, and reduced downtime during industrial changeover operations."
Disclaimer: Curated by HT Syndication.
