MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202611024963 A) filed by Thapar Institute Of Engineering & Technology, Patiala, Punjab, on March 3, for 'a method to predict the functional properties of metallic foams.'
Inventor(s) include Dr. Rohit Ahuja; Muskan; Dr. Ratnesh Kumar Raj Singh; and Archana Singh.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method to predict the functional properties of metallic foams that requires the steps of preparing a metal substrate by drilling holes in it and filling the said holes with a foamable mixture. The holes are then subjected to Friction Stir Processing (FSP) to promote the distribution of the foamable mixture. Followed by the latter, a combined heat treatment is applied at varied intervals to initiate foaming within the processed region. This processed region is then polished and analyzed to determine one or more pore-related parameters. The other aspect of the invention lies in structuring the experimental parameters and corresponding foam characteristics into a dataset to obtain foam quality indicators, by using which, one or more models are trained to establish a relationship between experimental parameters and foam characteristics. Finally, the most suitable model is selected to interpret the influence of the experimental parameter on the foam characteristics, thereby predicting the functional properties of the metallic foam."
Disclaimer: Curated by HT Syndication.
