MUMBAI, India, Feb. 6 -- Intellectual Property India has published a patent application (202631008076 A) filed by National Institute Of Technology, Silchar, Assam, on Jan. 27, for 'a method for manufacturing eco-friendly fused deposition modelling filament from printed circuit board waste.'
Inventor(s) include Neog, Debaraj; Sharma, Vikas; Neog, Ankur Jyoti; Nath, Kaushik Ranjan; Deoghare, Ashish Bhalchandra; and Mahmun, Amdadul.
The application for the patent was published on Feb. 6, under issue no. 06/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method for manufacturing eco-friendly fused deposition modelling filament from printed circuit board waste. The development of eco-friendly composite filaments for Fused Deposition Modelling (FDM) by utilizing non-metallic electronic waste from printed circuit boards (PCBs). Discarded PCBs (101) are subjected to grinding (102) and sieving (103) to obtain fine PCB powder (104) of particle size less than 150 microns. The PCB powder is used as a filler material and blended with thermoplastic polymers comprising Polylactic Acid (PLA) granules (106) and Polyethylene Terephthalate Glycol (PETG) granules (105). The polymer-PCB mixtures are prepared in compositions of PLA 74%, PETG 23%, PCB 3% and PLA 72%, PETG 22%, PCB 6% by weight. The blended material is dried in a hot air oven (107) at 90 C for 6-7 hours and subsequently extruded using a single-screw extruder (108) to form a continuous filament (109). The invention enables recycling and upscaling of PCB waste while producing stable, printable filaments compatible with conventional FDM 3D printing processes."
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