MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517058958 A) filed by Shin-Etsu Chemical Co. Ltd., Tokyo, on June 19, for 'a low-residue high temperature-resistant dry adhesive and methods of use.'
Inventor(s) include Aksak, Burak; and Geikowsky, Elliot.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "A dry adhesive microfiber array comprising a plurality of fibers with tips adapted to contact a surface, where the dry adhesive is capable of adhering to the surface at elevated temperatures. The bonding strength of the dry adhesive remains constant or increases with increasing substrate/dry adhesive/ carrier temperature. The dry adhesive can be debonded without leaving a residue on the surface of the substrate. In addition, the effect of temperature on bonding strength of the dry adhesive is reversible."
The patent application was internationally filed on Dec. 21, 2023, under International application No.PCT/US2023/085474.
Disclaimer: Curated by HT Syndication.
