MUMBAI, India, June 20 -- Intellectual Property India has published a patent application (202321086882 A) filed by Lchp Insulation Llp, Navi Mumbai, Maharashtra, on Dec. 19, 2023, for 'a lightweight fibrous mat with embedded lchp particles.'
Inventor(s) include Ranjan, Rahul.
The application for the patent was published on June 20, under issue no. 25/2025.
According to the abstract released by the Intellectual Property India: "The present invention describes a lightweight fibrous mat and a method of preparing the same with embedded low conductivity hydrophobic powder (LCHP). The invention pertains to a novel fiber-reinforced mat for thermal insulation and other applications. The mat integrates low conductivity hydrophobic powder (LCHP) particles, particularly silicon dioxide-based, within a nonwoven fiber structure. The fibers not only adhere to the LCHP but also form bonds with each other. The preparation process of the fibrous mat involves synthesis of LCHP within the fiber nonwoven, followed by controlled gelation, supercritical drying, and thermal consolidation. The lightweight fibrous mat from the synthesis exhibits a low thermal conductivity of 0.018 W/mK and a thickness of 1500 GSM. The mat's application versatility extends beyond thermal insulation, in acoustic absorption and adsorption of liquids, vapors, and gases. Overall, the invention offers a lightweight, flexible, and high-performance solution to address challenges associated with conventional insulation materials."
Disclaimer: Curated by HT Syndication.
