Intellectual Property India Publishes Patent Application for 'A Levelling And Spacing Device For Tiles, Slabs Or The Like' Filed by Dakota Group S. A. S. Di Zeno Cipriani & C.

MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202647024511 A) filed by Dakota Group S. A. S. Di Zeno Cipriani & C., Affi, Italy, on March 2, for 'a levelling and spacing device for tiles, slabs or the like.'

Inventor(s) include Cipriani, Zeno.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "A levelling and spacing device for tiles, slabs or the like, arranged to cover or line a flat surface, of the kind used to mutually level and space at least two adjacent tiles (P, P'), the said device comprising an elongated support body or rod (2), which is suitable to be arranged between at least two adjacent tiles and, to this end, is equipped with a base (3) designed to be positioned under the mutually facing edges of the two adjacent tiles The elongated body or rod (2) develops orthogonally from the base (3) and is equipped with means for the gripping thereof by an external pressure and levelling body (10) which comprises a structure equipped with means to grip, quickly and on command, the elongated body or rod (2) so that, through the action of the pressure member (10) coupled with the elongated body or rod (2), the pressure body (6) ends up pushing, in direct contact, the flat upper surfaces of the adjacent tiles (P, P'). Coupling and centring means are envisaged which implement a coaxial coupling between a portion of the frustoconical surface (8) of the pressure body (6) structure and a portion of the coaxial frustoconical surface (9) whose task is to push the annular surface (11) of the pressure body (10) into contact with the parts of the upper surfaces of the edges of the tiles by means of its own support surface (11), the said annular rest surface (11) being contained within the outer limits of the lower edge of the pressure body (6)."

The patent application was internationally filed on July 22, 2024, under International application No.PCT/IB2024/057094.

Disclaimer: Curated by HT Syndication.