MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541134612 A) filed by Aditya University; Aditya College Of Engineering And Technology; Aditya College Of Pharmacy; and Aditya Degree College, Surampalem, Andhra Pradesh, on Dec. 31, 2025, for 'a lapping device with dual-pattern modes for enhanced precision surface finishing and method thereof.'
Inventor(s) include Dr. Pritam Kumar Das; Dr. Ch. V Raghavendran; Attru Hanumantharao; Sree Geetha Adathakua; and Dr. B. E. V. L Naidu.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "The present disclosure proposes a lapping device (100) that is capable of selectively performing infinity and radial lapping motions through a solenoid-controlled drive mechanism, and a corresponding method for achieving enhanced material removal uniformity and surface accuracy for high-precision finishing applications in automotive, aerospace, bearing manufacturing, instrumentation, and precision machining industries. The lapping device (100) comprises a base (102), a support frame (108), a casing (114), a driving unit (145A), a holding fixture (146), a linkage assembly (156), and a gear assembly (168). The lapping device (100) improves surface accuracy, flatness, and material removal consistency by offering precise multi-directional motion control. The lapping device (100) accommodates a wide range of workpiece sizes and materials, increasing versatility in precision finishing applications. The lapping device (100) decreases setup time by allowing tool-less and fast mode changeover, resulting in faster operational cycles and higher productivity."
Disclaimer: Curated by HT Syndication.
