MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202411070497 A) filed by Schneider Electric India Private Limited, New Delhi, on Sept. 18, 2024, for 'a hinge assembly for enclosure doors.'
Inventor(s) include Deshpande, Harsha Rugved; and Bhole, Pritesh Kamlakar.
The application for the patent was published on April 10, under issue no. 15/2026.
According to the abstract released by the Intellectual Property India: "The present disclosure envisages a hinge assembly (100) for enclosure doors and a door assembly (200) having the hinge assembly (100). The present disclosure relates to a hinge assembly (100) for a door enclosure in a panel board comprising a hinge mechanism integrated into the door (130). The hinge mechanism comprises a hinge affixed to an operative side of the door (130). The hinge includes an extruded part with at least one slot (101) adapted to accommodate a bush (120). Further, the hinge includes a projection (105) to define the position of the hinge relative to a vertical pillar (145) thereby ensuring a secured hinge point (155). A connector (125) is adapted to be fitted within the bush (120), allowing the connector (125) to rotate within the pivot maintaining appropriate alignment thereby restricting tilting. Advantageously, the present disclosure leads to an efficient hinging assembly (100) for the enclosure doors to ensure a consistent and precise alignment of the door (130) to prevent misalignment, sagging and seal peeling."
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