Intellectual Property India Publishes Patent Application for 'A Heat-Resistant Packaging Material For Temperature-Sensitive Drugs' Filed by Graphic Era; and Graphic Era Hill University

MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511127802 A) filed by Graphic Era; and Graphic Era Hill University, Dehradun, Uttarakhand, on Dec. 16, 2025, for 'a heat-resistant packaging material for temperature-sensitive drugs.'

Inventor(s) include Deependra Pratap Singh; and Deepika Raina.

The application for the patent was published on Jan. 23, under issue no. 04/2026.

According to the abstract released by the Intellectual Property India: "The invention relates to a heat-resistant packaging material for temperature-sensitive drugs, comprising multilayer components including a high-temperature outer layer (101), nano-insulative core (102), barrier reinforcement layer (103), mechanical stabilization layer (104), adhesive interface (105), and inert drug-contact layer (106). The composite resists elevated temperatures, maintains barrier integrity, and protects pharmaceutical products from degradation. The invention provides improved thermal shielding, mechanical durability, and drug compatibility, enabling safer storage and transport of temperature-sensitive formulations."

Disclaimer: Curated by HT Syndication.