MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517059258 A) filed by Sulzer Management Ag, Winterthur, Switzerland, on June 20, for 'a devolatilization apparatus comprising a hollow double-plate assembly.'
Inventor(s) include Yu, Yingchuan; Zhang, Sen; Zhu, Hui Feng; Lew, Chin Chyau; Guo, Rong Gang; and Li, Zhe.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a devolatilization apparatus for devolatilizing a composition comprising a volatile component, such as for devolatilizing a solid or liquid polymer composition comprising non-reacted monomer, solvent and/or by-product, wherein the devolatilization apparatus comprises a vessel comprising at least one inlet for the composition to be devolatilized, at least one outlet for devo-latilized composition, at least one outlet for gas, at least one heatable tray and op-tionally at least one heatable distributor, wherein at least a section of at least one heatable tray and/or of at least one heatable distributor comprises a hollow dou-ble-plate assembly comprising an upper plate and a lower plate being arranged on top of each other, but spaced apart so that a void chamber is defined there-between, wherein each of both plates comprises a plurality of openings, wherein each opening of the upper plate is surrounded by a wall extending through the void chamber and surrounding an opening of the lower plate so as to form a plural-ity of channels being fluid-tightly separated from the hollow space being defined in the void chamber between the channels, wherein the hollow space is connected with an inlet for heat medium and with an outlet for heat medium, wherein the up-per plate and the lower plate of the hollow double-plate assembly are connected with each other at their sides through sidewalls, between which the void chamber is defined, wherein the at least one heatable tray and/or at least one heatable dis-tributor extends over 10 to 99% of the cross-sectional area of the vessel and is surrounded by a non-perforated weir."
The patent application was internationally filed on Dec. 11, 2023, under International application No.PCT/CN2023/137837.
Disclaimer: Curated by HT Syndication.
