MUMBAI, India, Jan. 8 -- Intellectual Property India has published a patent application (202511104875 A) filed by Graphic Era, Dehradun, Uttarakhand, on Oct. 30, 2025, for 'a composition, system and method for nucleate boiling in binary liquid systems using copper particle-based thermal spray coatings.'
Inventor(s) include Dr. Chandra Kishore; and Dr. Gagan Bansal.
The application for the patent was published on Dec. 12, under issue no. 50/2025.
According to the abstract released by the Intellectual Property India: "This invention relates to thermal management in binary liquid systems and discloses a system comprising a thermally conductive substrate (10) that is pretreated by cleaning and mechanical roughening, a copper particle-based coating (20) deposited via a thermal spraying deposition unit (30) under controlled parameters-such as torch temperature, particle velocity, spray angle, and stand-off distance-to achieve a micro/nano-textured surface bearing numerous nucleation sites defined by micro-cavities, crevices, peaks, and valleys, and optionally a post-deposition treatment module (40) for heat treatment. The invention also includes a method for fabricating engineered boiling surfaces, ensuring metallurgical bonding and enhanced heat transfer performance in nucleate boiling applications."
Disclaimer: Curated by HT Syndication.
