MUMBAI, India, July 11 -- Intellectual Property India has published a patent application (202511061360 A) filed by Noida Institute Of Engineering & Technology, Greater Noida, Uttar Pradesh, on June 27, for 'a compact ai-based heat management device for laptop processors.'
Inventor(s) include Sachin Singh.
The application for the patent was published on July 11, under issue no. 28/2025.
According to the abstract released by the Intellectual Property India: "The present invention discloses a compact AI-based heat management device (100) comprising micro-fan (110), thermoelectric cooler (120), sensors (140), smart ventilation valve (130), and AI module (150). The AI predicts processor heat spikes and activates cooling elements in advance, ensuring optimal performance without throttling. The device (100) integrates with the OS via a communication unit (170) for adaptive cooling, minimal power usage, and low noise in a sub-5mm form factor."
Disclaimer: Curated by HT Syndication.
