MUMBAI, India, April 11 -- Intellectual Property India has published a patent application (202517015094 A) filed by Creamill Oy, Tampere, Finland, on Feb. 21, for 'a closing means for a flexible package, a flexible package with a closing means, and a method for manufacturing a package with a closing means.'
Inventor(s) include Koskinen, Matti.
The application for the patent was published on April 11, under issue no. 15/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a closing means for closing an open side of a flexible package. The closing means comprises a material blank provided with two creases, an attachment surface, a re-closable closing surface, and a non-adhesive surface. The attachment surface is provided with adhesive for attaching the flexible package to the first outer wall. The attachment surface is between the first flank and the first crease of the closing means. The non-adhesive surface of the closing means is between the second crease and the second flank of the closing means, and adhesive is provided on the re-closable closing surface between the first and second creases. The closing surface whose size is either equal to or smaller than the non-adhesive surface is arranged to be removably attached, in the closed position, across the open side of the flexible package to the second outer wall of the flexible package and, in the closed position, to the non-adhesive surface of the closing means. The invention also relates to a method for manufacturing a flexible package equipped with a closing means."
The patent application was internationally filed on July 05, 2023, under International application No.PCT/FI2023/050429.
Disclaimer: Curated by HT Syndication.
