MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202611048146 A) filed by Abhishek Mehta; Gurjeet Singh Pandher; Er. Harwinder Singh; Deepti Chamoli; Ravi; and Deepak Patel, Fatehgarh Sahib, Punjab, on April 15, for 'a biodegradable smart packaging system with embedded rfid and a process for preparation thereof.'
Inventor(s) include Abhishek Mehta; Gurjeet Singh Pandher; Er. Harwinder Singh; Deepti Chamoli; Ravi; and Deepak Patel.
The application for the patent was published on May 29, under issue no. 22/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a biodegradable smart packaging system with embedded RFID and a method for preparation thereof, intended for sustainable supply chain and inventory management applications. The method comprises preparing a biodegradable base layer from agricultural fiber and biodegradable polymer, creating a localized cavity within said layer, and integrally embedding a radio frequency identification (RFID) tag within the packaging structure. The RFID tag is sealed using a biodegradable adhesive and a fiber overlay to provide a tamper-evident, unified construction. The packaging structure is engineered with a specific thickness of 1-5 mm adjacent to the tag to permit optimal signal transmission and detection by an RFID reader. The resulting smart packaging exhibits full bio-degradation within 60 days under composting conditions while providing inherent tracking and authentication capabilities. The invention provides a renewable, integrated, and scalable alternative to conventional labeled packaging, enhancing product traceability without compromising environmental sustainability."
Disclaimer: Curated by HT Syndication.
