MUMBAI, India, Feb. 27 -- Intellectual Property India has published a patent application (202641018301 A) filed by Sri Krishna College Of Engineering And Technology, Coimbatore, Tamil Nadu, on Feb. 18, for 'a bim-integrated system and method for structural retrofitting using trm and sma.'
Inventor(s) include Ms. R. Hemavathi; Merencia A; Priyadharshini S; Sanjay Muthiah R; and Selvi P.
The application for the patent was published on Feb. 27, under issue no. 09/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a BIM-integrated system and method for structural retrofitting and rehabilitation of existing structures (10). The invention employs a Textile Reinforced Mortar layer (12), comprising a textile reinforcement grid (12a) embedded in an inorganic mortar matrix (12b), applied to structural elements (11) to enhance tensile strength, crack resistance, and durability. One or more Shape Memory Alloy elements (13), preferably Nitinol-based, are anchored (13a) to the structural elements (11) to provide self-centering capability and energy dissipation under seismic or cyclic loading. A Building Information Modeling platform (15) digitally integrates material properties (15a), structural analysis (15b), construction and cost data (15c), and real-time monitoring through a digital twin module (15d). Sensors (14) installed on the retrofitted structure transmit performance data via a communication link (16) to enable continuous assessment and predictive maintenance. The invention provides a smart, resilient, and sustainable solution for performance-based structural rehabilitation."
Disclaimer: Curated by HT Syndication.
