MUMBAI, India, Feb. 13 -- Intellectual Property India has published a patent application (202541129079 A) filed by Chennai Institute Of Technology, Chennai, Tamil Nadu, on Dec. 19, 2025, for '3d printed hybrid infill shoe sole grip repair pads for anti-slip traction enhancement.'
Inventor(s) include Murugan V; and Dr V Dhinakaran.
The application for the patent was published on Feb. 13, under issue no. 07/2026.
According to the abstract released by the Intellectual Property India: "This invention relates to a 3D-printed hybrid-infill shoe sole grip repair pads for antislip traction enhancement. It typically includes a SSG-repaired pad (1), a TPU filament (2), a 3d printer (3), a hybrid infill structure (4), a line infill pattern (5), a gyroid infill pattern (6), a metatarsal pad (7), a heel pad (8), a rubber-based adhesive (9), and a shoe sole (10). This invention provides a secure hands-free device viewing while charging in a single, portable unit. This invention is ideally suited for travellers, commuters, and office workers seeking a stable, all-in-one charging and viewing solution in environments like cars, hotels, or desktop."
Disclaimer: Curated by HT Syndication.
