Intellectual Property India Publishes Patent Application for '3D Network Structure With High Resilience, Soft Touch Feeling And Good Quietness And Method Of Preparing The Same' Filed by Basf Se

MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517097991 A) filed by Basf Se, Ludwigshafen am Rhein, Germany, on Oct. 10, for '3d network structure with high resilience, soft touch feeling and good quietness and method of preparing the same.'

Inventor(s) include Jin, Hai Liang; Yan, Hui Zhi; and Weng, Jun.

The application for the patent was published on Nov. 21, under issue no. 47/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a 3D network structure comprising a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a hardphase ratio ranging from 10wt% to 40wt% and wherein the thermoplastic polyurethane has a processing temperature window at which the thermoplastic polyurethane has a viscosity ranging from 103 Pa s to 105 Pa s. The present invention also relates to an article comprising the 3D network structure."

The patent application was internationally filed on Mar. 11, 2024, under International application No.PCT/EP2024/056307.

Disclaimer: Curated by HT Syndication.