Intellectual Property India Publishes Patent Application for “semiconductor Package And Method Of Manufacturing The Same”

MUMBAI, India, Aug. 24 -- Intellectual Property India has published a patent application (202514038494 A) filed by Jmj Korea Co. , Ltd on April 22, 2025, for “semiconductor Package And Method Of Manufacturing The Same”.

Inventors include Choi, Yun Hwa; Park, Sangdu; Park, Hosoub; and Lee, Junho.

The application for the patent was published on August 21, 2026, under issue no. 34/2026.

Abstract: The present invention provides a semiconductor package including: at least one insulating substrate on which at least one insulating layer is formed; at least one metal pattern layer formed on one surface of the insulating layer; at least one heat release metal layer formed on the other surface of the insulating layer; at least one semiconductor chip comprising lower surfaces bonded to the metal pattern layer and upper surfaces bonded to at least one electrical connecting member; a molding housing covering the at least one semiconductor chip and a part of or entire metal pattern layers; at least one terminal comprising one end electrically or structurally connected to the insulating substrate and the other end exposed to the outside of the molding housing; and at least one heat sink comprising heat radiation pads and at least one heat radiation fins structurally connected thereto, at least one surface partially or entirely exposed from the lower surface, the upper surface, or the lower and upper surfaces of the molding housing, and the other surfaces structurally bonded to the heat release metal layers, wherein the thickness of the heat sink is greater than the sum of the thickness of the metal pattern layer and the thickness of the heat release metal layer and the total area of the at least one heat radiation pad is smaller than the total area of the heat release metal layers. Accordingly, thermal conductivity may be increased by relatively thin metal pattern layers and heat release metal layers and heat emission effect occurring due to contact with cooling water may be increased by relatively thick heat sinks.

Disclaimer: Curated by HT Syndication.