MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202441094963 A) filed by Samsung Electronics Co. , Ltd on December 03, 2024, for “multispectral Structural Analysis For Enhanced Object Inspection Using Uwb”.
Inventors include Siddharth Gupta; Dewanshu Haswani; and Vijay Narayan Tiwari.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: ABSTRACT “MULTISPECTRAL STRUCTURAL ANALYSIS FOR ENHANCED OBJECT INSPECTION USING UWB” Embodiments disclosed herein relates to a method and electronic device for determining a level of quality of an object. The method includes receiving, by an electronic device (101), reference signals from each layer of plurality of layers of the object. Further, method includes determining properties of each layer of the plurality of layers of the object from the reference signals and a degree of strength of each layer of the plurality of layers of the object from the reference signals using a plurality of models. Further, method includes determining the level of quality of the object based on the properties of each layer of the plurality of layers of the object and the degree of strength of each layer of the plurality of layers of the object. Fig. 2A
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