Intellectual Property India Publishes Patent Application for “layer Stack, Method And Process System”

MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202514043367 A) filed by Von Ardenne Asset Gmbh & Co. Kg on May 05, 2025, for “layer Stack, Method And Process System”.

Inventors include Schneiderlchner, Eric; Lin, Volker; and Dietsch, Tina.

The application for the patent was published on October 02, 2026, under issue no. 40/2026.

Abstract: According to various aspects, a layer stack comprises: a carrier layer; one or more passivation layers formed by a physical vapor deposition process, preferably comprising a first passivation layer and/or a second passivation layer, for each of the one or more passivation layers, a metal oxide containing protection layer formed by a chemical vapor deposition process between the passivation layer and the carrier layer.

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