Intellectual Property India Publishes Patent Application for “iot-Based Automated Copper Etching System For Printed Circuit Boards”

MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202621074086 A) filed by Ashokrao Mane Group Of Institutions, An Autonomous Institute, Kolhapur on June 15, 2026, for “iot-Based Automated Copper Etching System For Printed Circuit Boards”.

Inventors include Dr. Sarvajeet Amarjeet Bhosale; Dr. Sangeeta Rajendra Chougule; Pravin Basveshwar Ghewari; Shivani Shivaji Chikhalkar; Minakshi Maruti Mhetar; Piyali Pintu Khatua; and Mrs. Shilpa A. Shankardas.

The application for the patent was published on August 14, 2026, under issue no. 33/2026.

Abstract: An IoT-based automated copper etching system (100) and method for printed circuit boards is disclosed. The system comprises a housing (10) enclosing a temperature controlled etching chamber (50) holding an etching solution (52) and a substrate holder (56) suspending a copper-clad board substrate (54) substantially vertically therein. A heating element (40), an agitation assembly (42, 58) and sensors for temperature (30), liquid level (32) and solution condition (34) are coupled to a microcontroller (20) having an integrated wireless transceiver (60). The microcontroller (20) regulates the etching solution (52) to a set-point band of about 45 °C by closed-loop control of the heating element (40), imparts uniform modulated agitation, and streams sensed parameters in real time through a cloud server (70) to a mobile application (80) and web dashboard (82). Upon detection of an etching end-point determined from elapsed time and/or sensed solution condition, the microcontroller (20) automatically de-energises the heating element (40) and agitation assembly (42), triggers an audio-visual alarm (44) and transmits a completion alert, thereby preventing over-etching. Experimentally, the system achieves an etch-quality index of up to 98 %, an approximately 30 % reduction in processing time and an approximately 20 % reduction in etchant consumption relative to manual etching, while improving operator safety and reproducibility. Reference Figure for Abstract: FIG. 1.

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