MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202631069870 A) filed by Asansol Engineering College on June 04, 2026, for “high-Precision Selective Laser Sintering Of Micron-Scale Copper Powder Using Nd:yag Laser Technology”.
Inventors include Dr. Srijan Paul; Dr. Sarnendu Paul; and Mr. Kaushal Kishore.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: Abstract The present disclosure provides a high-precision selective laser sintering system and an associated method for fabricating high-density metallic components using micron-scale copper powder materials (1–45 µm) and optimized Nd:YAG laser technology. The apparatus comprises a copper powder delivery unit equipped with vibratory fluidization, a controlled Nd:YAG laser source operating at a fundamental wavelength of approximately 1064 nm, a galvanometric beam scanning mechanism, a precision recoating assembly, a vertically translatable build platform, a closed-loop thermal management module, and an airtight inert atmosphere chamber. By iteratively sintering ultra-thin layers of fine copper powder in an oxygen-depleted environment according to computer-generated CAD data, the system achieves a significant increase in energy absorption, mitigates rapid thermal dissipation, and comprehensively prevents high-temperature oxidation. The resulting components possess superior metallurgical bonding, high dimensional accuracy, reduced residual porosity, and near-theoretical thermal and electrical conductivity profiles.
Disclaimer: Curated by HT Syndication.
