MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202418047536 A) filed by Flexcon Company, Inc. on June 20, 2024, for “electrically Conductive Materials Formed By Electrophoresis”.
Inventors include Kenneth Burnham; and Richard Skov.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: An electrically conductive composite having a thickness in a z direction that is substantially less than a length in an x direction and a width in a y direction, said electrically conductive composite comprising: electrically conductive particles dispersed within an acrylic pressure sensitive adhesive, said electrically conductive particles being substantially smaller than the thickness of the electrically conductive composite, and said electrically conductive particles remaining suspended within acrylic pressure sensitive adhesive in a concentration insufficient to provide particle-to-particle electrical conductivity through the acrylic pressure sensitive adhesive in the z direction; and at least one electrically conductive path formed through the acrylic pressure sensitive adhesive along a direction of an applied electric field, said electrically conductive path being formed by at least some of the electrically conductive particles material while the acrylic pressure sensitive adhesive remains viscoelastic and suitable for use as a pressure sensitive adhesive, wherein the acrylic pressure sensitive adhesive has a viscosity of at least five orders of magnitude higher than 10 cp. Fig. 2
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