MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202641074782 A) filed by Vellore Institute Of Technology on June 17, 2026, for “an Electrostatically Crosslinked Bioselective Scaffold”.
Inventors include Dr. Debasish Mishra; and Gutti Pavan.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: The present invention relates to electrostatically crosslinked chitosan-based bioselective scaffolds functionalized with hydroxyquinoline-metal complexes and a method for their preparation. The scaffold comprises a three-dimensional porous chitosan matrix crosslinked with sodium tripolyphosphate (TPP) and functionalized with hydroxyquinoline-metal complexes comprising zinc-hydroxyquinoline, copper-hydroxyquinoline, or combinations thereof. The method includes preparation of a chitosan solution, formation of a porous scaffold through freezing and lyophilization, electrostatic crosslinking using sodium tripolyphosphate, and incorporation of hydroxyquinoline-metal complexes through immersion-mediated loading. The resulting scaffold exhibits enhanced structural stability, controlled biodegradation, antibiofilm activity, antimicrobial properties, red blood cell compatibility, and cytocompatibility with mammalian cells. The interconnected porous architecture facilitates cellular infiltration, nutrient transport, and tissue integration while providing sustained bioactive functionality. The scaffold is suitable for applications including tissue engineering, wound healing, bone regeneration, implant-associated infection prevention, biomedical devices, bioactive materials, environmental remediation, and adsorbent systems. The synergistic combination of chitosan, sodium tripolyphosphate, and hydroxyquinoline-metal complexes provides a multifunctional bioselective scaffold exhibiting improved biological performance and broad applicability across biomedical, environmental, and healthcare-related fields. Fig 1 to 9.
Disclaimer: Curated by HT Syndication.
