MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517080892 A) filed by Evonik Operations Gmbh, Essen, Germany, on Aug. 26, for 'heat-sealable coating system suitable for the sealing of various types of substrates.'
Inventor(s) include Kersten, Erik; Marz, Monika; Leber, Nadine; Hartmann, Jurgen; Scharfenberg, Markus; and Schiem, Nicolas.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "The present invention is directed to a heat-sealable coating system suitable for the sealing of various types of substrates, comprising a film-forming dispersion, comprising a polyester or polyester mixture as polymer type A, a poly(meth)acrylate as polymer type B, a graft copolymer of polymer type A and polymer type B as polymer type AB, a polyolefin or a polyolefin mixture as polymer type C, and a graft copolymer as polymer type CD, composed of polymer type C and of a poly(meth)acrylate as polymer type D, wherein said dispersion comprises of from 30 % to 60 % by weight of ethyl acetate based on the total weight of the dispersion, and wherein said dispersion comprises of from 20% to 50% by weight of polymer type A, from 10% to 20% by weight by weight of polymer type B, from 10% to 20% by weight of polymer type AB, from 5% to 25% by weight by weight of polymer type C, and from 15 to 35% by weight by weight of polymer type CD, based in each case on the total mass of the polymer types A, B, C, AB, and CD, and to a process for the sealing of various types of substrates, wherein the foil is coated with a coating system according to the invention."
The patent application was internationally filed on Jan. 17, 2024, under International application No.PCT/EP2024/051017.
Disclaimer: Curated by HT Syndication.
